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2 article(s) from Liang, Wei

Molecular dynamics simulations of nanoindentation and scratch in Cu grain boundaries

Shih-Wei Liang,
Ren-Zheng Qiu and
Te-Hua Fang

Beilstein J. Nanotechnol. 2017, 8, 2283–2295, doi:10.3762/bjnano.8.228

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Figure 1: Physical model diagrams of (a) transverse grain boundary indentation, (b) vertical grain boundary i...

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Figure 2: The slip vector diagrams of the transverse grain boundary with the different angles of (a) θ = 10°,...

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Figure 3: The slip vector diagrams of the transverse grain boundary with the different angles of (a) θ = 10°,...

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Figure 4: The atomic flow diagrams of the transverse grain boundary with the different angles of (a) θ = 10°,...

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Figure 5: The slip vector diagrams of the transverse grain boundary with the (a) 3 layers, (b) 4 layers, and ...

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Figure 6: The slip vector diagrams of the transverse grain boundary with the (a) 3 layers, (b) 4 layers, and ...

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Figure 7: The atomic flow diagrams of the transverse grain boundary with the (a) 3 layers, (b) 4 layers, and ...

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Figure 8: The normal force versus time for the transverse grain boundary with 3, 4 and 6 layers for an indent...

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Figure 9: The slip vector diagrams of the vertical grain boundary with the different angles of (a) θ = 10°, (...

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Figure 10: The slip vector diagrams of the vertical grain boundary with the different angles of (a) θ = 10°, (...

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Figure 11: The von Mises stress diagrams of the vertical grain boundary with the different angles of (a) θ = 1...

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Figure 12: The normal force versus time for the vertical grain boundary with different angles of θ = 10–40° fo...

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Figure 13: The slip vector diagrams of the vertical grain boundary with the different angles of (a) θ = 10°, (...

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Figure 14: The atomic flow diagrams of the vertical grain boundary with the different angles of (a) θ = 10°, (...

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Figure 15: The tangential force versus time for the vertical grain boundary at different angles θ = 10–40° for...

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Figure 16: The average resistance coefficient versus the different angles for a scratch of 5 nm.

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Full Research Paper

Published 01 Nov 2017

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Fast diffusion of silver in TiO₂ nanotube arrays

Wanggang Zhang,
Yiming Liu,
Diaoyu Zhou,
Hui Wang,
Wei Liang and
Fuqian Yang

Beilstein J. Nanotechnol. 2016, 7, 1129–1140, doi:10.3762/bjnano.7.105

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Figure 1: Schematic of the facile route for the preparation of Ag@TiO₂ nanotubes.

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Figure 2: SEM images of the prepared pure TiO₂ nanotubes by a two-step anodization process without heat treat...

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Figure 3: TEM images of the pure TiO₂ nanotubes heat-treated at 500 °C for 2 h; (a) TEM image of the pure TiO₂...

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Figure 4: XRD patterns of TiO₂ nanotube arrays with Ag nanofilm heat treated at three different temperatures ...

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Figure 5: SEM images of the TiO₂ nanotube arrays with Ag nanofilm after different heat treatment for 2 h; (a)...

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Figure 6: SEM images of the heat-treated TiO₂ nanotube arrays with Ag nanofilm at 400 °C for different period...

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Figure 7: TEM images of the TiO₂ nanotube arrays with Ag nanofilm heat treated at 500 °C for 2 h; (a) TEM ima...

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Figure 8: Migration distance of Ag atoms on the outmost surface of the TiO₂ nanotubes as a function of the ti...

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Figure 9: Temperature dependence of the migration distance of Ag atoms on the outmost surface of the TiO₂ nan...

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Full Research Paper

Published 03 Aug 2016

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Molecular dynamics simulations of nanoindentation and scratch in Cu grain boundaries

Fast diffusion of silver in TiO2 nanotube arrays

Fast diffusion of silver in TiO₂ nanotube arrays